Oyama, Tochigi; September 30, 2024, Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, exhibits to APCS (Advanced Packaging and Chiplet Summit) 2024, held in Tokyo Big Sight, Tokyo, Japan from Wednesday, December 11 through Friday, December 13, 2024 JST.
Gigaphoton will introduce its advanced ablation processing products, including the latest test results.
We would like to welcome your visit.
| Exhibition | Advanced Packaging and Chiplet Summit 2024 |
| HP Address | https://www.semiconjapan.org/en/apcs |
| Holding Period | from December 11 through 13 |
| Place | Tokyo Big Sight |
| Booth No. | 2555 |
About GIGAPHOTON
Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit https://gigaphoton.com/
| Media Contact: GIGAPHOTON Inc. Corporate Planning Department Kenji Ohishi TEL: +81-285-37-6931 Email: web_info@gigaphoton.com |