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<p>Oyama, Tochigi; December 4, 2024, Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that a press release in collaboration with NEDO (New Energy and Industrial Technology Development Organization) has been published on NEDO&#8217;s website.</p>



<p>Gigaphoton has participated in NEDO&#8217;s project, “Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems,&#8221; and the results of this collaboration have now been announced in a press release from NEDO.</p>



<p>The release is available on NEDO&#8217;s website. Please read it via the link below.<br><br><a href="https://www.nedo.go.jp/news/press/AA5_101796.html">https://www.nedo.go.jp/news/press/AA5_101796.html</a></p>



<p>About GIGAPHOTON</p>



<p>Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&amp;D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit <a href="https://gigaphoton.com/">https://gigaphoton.com/</a></p>



<figure class="wp-block-table"><table class="has-fixed-layout"><tbody><tr><td>Media Contact:<br>GIGAPHOTON Inc.<br>Corporate Planning Department<br>Kenji Ohishi<br>Email: <a href="mailto:web_info@gigaphoton.com">web_info@gigaphoton.com</a></td></tr></tbody></table></figure>


NEDO Announced the Results of Its Post-5G Systems R&D Project, in Collaboration with Gigaphoton


<p>Oyama, Tochigi; November 8, 2024, Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that the &#8220;G300K&#8221; micro via processing lightsource has been delivered to a Japanese equipment manufacturer, specialized in backend equipment manufacturing and the integrated system has been successfully installed at the facility of a company in the United States.</p>


<div class="wp-block-image">
<figure class="aligncenter size-large is-resized"><img loading="lazy" decoding="async" width="1024" height="576" src="https://webapi.gigaphoton.global/wp-content/uploads/2024/11/G300K-1-1024x576.jpg" alt="G300K, a KrF excimer laser for ultra-fine ablation processing" class="wp-image-9222" style="width:594px;height:auto" srcset="https://webapi.gigaphoton.global/wp-content/uploads/2024/11/G300K-1-1024x576.jpg 1024w, https://webapi.gigaphoton.global/wp-content/uploads/2024/11/G300K-1-300x169.jpg 300w, https://webapi.gigaphoton.global/wp-content/uploads/2024/11/G300K-1-768x432.jpg 768w, https://webapi.gigaphoton.global/wp-content/uploads/2024/11/G300K-1-1536x864.jpg 1536w, https://webapi.gigaphoton.global/wp-content/uploads/2024/11/G300K-1.jpg 1986w" sizes="(max-width: 1024px) 100vw, 1024px" /></figure></div>


<p class="has-text-align-center">G300K, a KrF excimer laser for ultra-fine ablation processing</p>



<p>Gigaphoton has applied its expertise in semiconductor lithography lightsources to develop a lightsource for ultra-fine ablation processing for advanced packaging processes.</p>



<p>The G300K, is an excimer laser based on KrF (248nm) wavelength, which is integrated into the processing equipment for semiconductor package substrates. It provides high power, high repetition rate, high reliability with long life modules. The excimer laser is primarily used in the process of creating micro-via holes with a diameter of 10μm or less, as well as trench patterns. It is expected to be adopted for the manufacturing of 2.5D/3D packages utilizing chiplets, which are projected to increase primarily used for AI chipsets.</p>



<p>Tatsuo Enami, President and CEO of Gigaphoton said, &#8220;In Gigaphoton, alongside our research and development of lightsources for semiconductor lithography, we have also been exploring various possibilities for the application of excimer lasers in other fields.<br>We will continue to accelerate our research and development efforts to expand into new areas.<br>As a critical lightsource manufacturer in the semiconductor manufacturing industry, we will continue to contribute to the industry through continuous research and development on new processes to facilitate the further implementation of excimer lasers.&#8221;</p>



<p>About GIGAPHOTON</p>



<p>Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&amp;D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit <a href="https://gigaphoton.com/">https://gigaphoton.com/</a></p>



<figure class="wp-block-table"><table class="has-fixed-layout"><tbody><tr><td>Media Contact:<br>GIGAPHOTON Inc.<br>Corporate Planning Department<br>Kenji Ohishi<br>TEL: +81-285-37-6931<br>Email: <a href="mailto:web_info@gigaphoton.com">web_info@gigaphoton.com</a></td></tr></tbody></table></figure>


Gigaphoton Delivers Excimer Laser to the United States for Micro Via Processing


<p>Oyama, Tochigi; September 30, 2024, <a href="https://www.gigaphoton.com/" data-type="link" data-id="https://www.gigaphoton.com/">Gigaphoton Inc.</a> (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, exhibits to <a href="https://www.semiconjapan.org/jp/apcs" data-type="link" data-id="https://www.semiconjapan.org/jp/apcs">APCS (Advanced Packaging and Chiplet Summit) 2024</a>, held in Tokyo Big Sight, Tokyo, Japan from Wednesday, December 11 through Friday, December 13, 2024 JST.</p>



<p>Gigaphoton will introduce its advanced ablation processing products, including the latest test results.</p>



<p>We would like to welcome your visit.</p>



<figure class="wp-block-table"><table class="has-fixed-layout"><tbody><tr><td>Exhibition</td><td>Advanced Packaging and Chiplet Summit 2024</td></tr><tr><td>HP Address</td><td><a href="https://www.semiconjapan.org/en/apcs">https://www.semiconjapan.org/en/apcs</a></td></tr><tr><td>Holding Period</td><td>from December 11 through 13</td></tr><tr><td>Place</td><td>Tokyo Big Sight</td></tr><tr><td>Booth No.</td><td>2555</td></tr></tbody></table></figure>



<p>About GIGAPHOTON</p>



<p>Since it was founded in 2000, GIGAPHOTON has delivered valuable solutions to semiconductor manufacturers throughout the world as a manufacturer of lightsources. In every stage from R&amp;D to manufacture, sales, and maintenance services, GIGAPHOTON is committed to providing world-class support delivered from the perspective of everyday users. For more information, please visit <a href="https://gigaphoton.com/">https://gigaphoton.com/</a></p>



<figure class="wp-block-table"><table class="has-fixed-layout"><tbody><tr><td>Media Contact:<br>GIGAPHOTON Inc.<br>Corporate Planning Department<br>Kenji Ohishi<br>TEL: +81-285-37-6931<br>Email: <a href="mailto:web_info@gigaphoton.com">web_info@gigaphoton.com</a></td></tr></tbody></table></figure>



<p></p>


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NEDO Announced the Results of Its Post-5G Systems R&D Project, in Collaboration with Gigaphoton

Gigaphoton Delivers Excimer Laser to the United States for Micro Via Processing

Gigaphoton exhibits to Advanced Packaging and Chiplet Summit 2024

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Chips are made with light

Get to knowGigaphoton

Quality & Reliability

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Sustainability

Service & Support

The Future is Today

Latest News

NEDO Announced the Results of Its Post-5G Systems R&D Project, in Collaboration with Gigaphoton

Gigaphoton Delivers Excimer Laser to the United States for Micro Via Processing

Gigaphoton exhibits to Advanced Packaging and Chiplet Summit 2024

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